FCR, RCA, RCN Series are formed by vacuum
depositing a resistive alloy on a usually flat substrate of ceramic.
Photo-lithographic or similar techniques are used to define the final
geometry and interconnecting traces. This technology provides for
close ratio matching and tracking in a network, as well as low stand-alone
temperature coefficient and resistance tolerance. Types includes precision
smd (FCR), smd array (RCA), and networks (RCN).
Chip Thick Film Dimension
Dimensions Type
L
W
H
L1
L2
FCR 03
1.60 ± 0.10
0.80 ± 0.10
0.45 ± 0.10
0.30 ± 0.20
0.30 ± 0.20
FCR 05
2.00 ± 0.15
1.25 ± 0.15
0.50 ± 0.10
0.40 ± 0.20
0.35 ± 0.15
FCR 06
3.10 ± 0.15
1.55 ± 0.15
0.55 ± 0.10
0.50 ± 0.25
0.50 ± 0.25
Chip Thick Film Characteristic
Type
Power Rating at 70°C
Max. RCWV
Max. Overload Voltage
Resistance Tolerance(%)
Resistance Range (Ω)
Standard Resistance Values
Min.
Max.
FCR03
1/10W
50V
100V
± 1% (F) ± 5% (J)
10Ω 1Ω
1MΩ 10MΩ
E-96 E-24
FCR05
1/8W
150V
300V
± 1% (F) ± 5% (J)
10Ω 1Ω
1MΩ 10MΩ
E-96 E-24
FCR06
1/4W
200V
300V
± 1% (F) ± 5% (J)
10Ω 1Ω
1MΩ 10MΩ
E-96 E-24
Dimensions Type
L
W
H
L1
L2
P
Q
RCA03-4D (0603)
3.2±0.2
1.6±0.15
0.5±0.1
0.30±0.15
0.35Max
0.8±0.1
0.5±0.1
Chip Array Characteristic
Type
Rated Power at70°C
Max. Working Voltage
Max. Overload Voltage
T.C.R. (ppm/°C)
Resistance Range
Jumper Rated Current
Jumper Resistance Value
Operating Temperature Range
F(±1%) E-96
G(±2%) J(±5%) E-24
RCA03-4D (0603)
0.063
50V
100V
± 200
100Ω~470KΩ
10Ω~1MΩ
1A
50mΩ MAX
-55°C~+125°C
Dimensions Type
L
W
H
L1
L2
P
Q
RCN06-10R RCN06-10S
6.4 ± 0.2
3.1 ± 0.2
0.55 ± 0.1
0.5 ± 0.3
0.5 ± 0.2
1.27 ± 0.1
0.8 ± 0.2
Chip Network Characteristic
Type
Rated Power at70°C
Max. Working Voltage
Max. Overload Voltage
T.C.R. (ppm/°C)
Resistance Range
Number of Terminals
Number of Elements
Operating Temperature Range
J (±5%) E-12
RCN06-10R RCN06-10S
1/16W
50V
100V
±200
10Ω~1MΩ
10
8
-55°C~+125°C
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