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Chip Precision Resistor Components
JIS-C-5202-5.5 RCWV*2.5 or Max Overloading Voltage , 5 seconds. , ΔR±0.5% for high power rating , Dielectric Withstand Voltage , By type , ... JIS-C-5202-7.2 96 hours @ +155°C without load , Low Temperature Operation , ΔR±0.05% , ΔR±0.2% , JIS-C-5202-7.1 1hour, -65& ... ...
Thin Film Chip Resistor Components
JIS-C-5202-7.2 1000 hours @ +125°C without load , Resistance to Soldering Heat , ≤ ±0.02% , ≤ ±0.1% , MIL-STD-202F Method 210E ...
Current Sensing Resistor (SMD) Passive Components
JIS-C-5202-5.5RCWV*2.5 or Max Overloading Voltage, 5 seconds , Resistance to Dry Heat , ±1%+0.5mΩ , ±1% , JIS-C-5202-7.296 hours @ + ...
Saw Dielectric Inductor Resistor Electronics
Our production and testing processes meet JIS standards, because the , whole thing is monitored step by step. Our strong research and develoption , ensures that you have access to the latest ...
Resistor Glossary Components
resistors for five seconds in the overload test. (JIS C 5201- 1 4.13) Typically the applied voltage in the short time overload test shall be 2.5 times larger than the rated voltage. However, it shall not ... in the dielectric withstanding voltage test. (JIS C 5201- 1 4.7) , Rated Ambient Temperature , The maximum ambient temperature at which resistors are capable of being used continuously with the ...
Precision Resistors Components
JIS C 5202 , MIL-R-10509F , Operating Temp.Range , -55°C ~ 155°C , , , Temp Coefficient (°C ) , ±25 ±50 ± ...
Metal Oxide Resistors Components
JIS C 5202 , MIL-R-22684B , Operating Temp.Range , -55°C~200°C , , , Temp.Coefficient (ppm C) , ± 300 , 5.2 , 4.6.11 , ...
Inductor
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...
Inductor
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...
Inductor
TEST METHOD(JIS C 5321) , Resistance to Soldering Heat , No evidence of damage Δ L/L shall be within ±3% , Immerse in the solder (H63A)of 260±5& ... TEST METHOD(JIS C 5321) , LOW TEMP. Characteristics , No evidence of damage, Δ L/L within ±5%, Q/Q within ±30% , Immerse in the solder (H63A)of ...