Low Ohmic Metal Strip Chip Resistors (LRP)

Low Value Chip Resistor (LRP) Introduction

Things go better with Token (LRP) high power metal strip chip, a very low value resistor.

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  • Power metal strip Low Value resistors (LRP)
  • High Power Metal Strip Chip resistors (LRP)

(LRP) Low ohm metal strip resistors from Token Electronics offer a wide range of high-power current sensing applications including power management of NB, MB and monitor, automotive, shunts and power amplifiers, DC-DC converter and charger, test & measurement instruments, linear power supplies and switching.

(LRP) Design for applications that require high power handling (Up to 3W) and low resistance values from 7mΩ to 100mΩ and come with a range of advantages including a wide temperature range and a varied choice of wide range package sizes 2512 with high current capability.

Token (LRP) is aiming for very high power-to-footprint size ratio, excellent frequency response and very low inductance in a solid metal nickel-chrome or manganese-copper allow resistive element with Low TCR ±50PPM/°C. Also, ideal for all types of voltage division, current sensing and pulse applications.

(LRP) series as current detection and current divider chips can be customized according to customers'needs. For special resistance value and latest product information, contact us with your specific needs.

Downloads Complete Specification PDF Metal Strip chip high Power Low Ohmic Resistors (LRP).

Features :
  • Very low inductance without Laser trimmed.
  • Customized Resistance Available. High power rating from 1W to 3W.
  • Low TCR ±50PPM/°C, ±75PPM/°C. Low resistance value 7mΩ to 100mΩ.
Applications :
  • SWPS: DC-DC converter, Charger, Adaptor.
  • For NB power management. For MB power management. For Monitor power management.

Chip 2512 (LRP) Dimensions & Construction

Chip 2512 (LRP) Dimensions & Construction
Power Metal Strip Chip 2512 (LRP) Dimensions & Construction
a Overcoat (molding)
b Marking
c Alloy Plate
d Internal Electrode (Cu)
e Barrier Layer (Ni)
f Solder Plating (Sn)
Type Size (Inch) L(mm) W(mm) T(mm) D(mm)
LRP12 2512 6.40±0.25 3.20±0.25 0.70±0.20 0.90±0.30
Notice :
  • TOKEN is capable of manufacturing the optional spec based on customer's requirement.

Electrical Specifications Chip 2512 (LRP)

Type Power Rating at 70°C Operating Temp. Range Resistance Tolerance (±%) Resistance (mΩ) TCR (±PPM/°C)
LRP12 (2512) 1W, 2W, 3W -55°C ~ +170°C ±0.5%, ±1%, ±5% 15, 18, 20, 22, 25, 30, 33, 35, 39, 40, 47, 50, 60, 68, 70, 75, 80, 82, 90, 91, 100 ±50
7, 8, 9, 10, 12, 15, 18, 20, 22, 25, 30, 33, 35, 39, 40, 47, 50, 60, 68, 70, 75, 80, 82, 90, 91, 100 ±75
  • Operating Current I = ( P / R ) , Operating Voltage V = ( P * R )
  • Token is capable of manufacturing the optional spec based on customer’s requirement.

Derating Curve (LRP)

Power Derating Curve
(LRP) Power Derating Curve

Recommend Land Pattern (LRP)

Recommend Land Pattern
Recommend Land Pattern
Type A (mm) B (mm) C (mm)
LRP12 4.00 2.00 3.50
  • *FR4 copper board, 100μm of copper pad thickness.

Packing Quantity & Reel Specifications (LRP)

Reel Specifications Dimensions
Reel Specifications Dimensions
Type Packaging Quantity Tape Width Reel Diameter ΦA (mm) ΦB (mm) ΦC (mm) W (mm) T (mm)
LRP12 Embossed 4,000 pcs 12 mm 7 inch 178.0±1.5 60.0±1.0 13.0±0.5 13.0±1.0 15.5±0.5

Emboss Plastic Tape Specifications (LRP)

(LRP) Emboss Plastic Tape Specifications
Low Ohm Metal Strip (LRP) Emboss Plastic Tape Specifications
Type A (mm) B (mm) W (mm) E (mm) F (mm) P0 (mm) P1 (mm) P2 (mm) ΦD0 (mm) ΦD1 (mm) T
LRP12 3.50±0.10 6.70±0.10 12.0±0.30 1.75±0.10 5.5±0.05 4.0±0.10 4.0±0.10 2.0±0.05 1.50±0.10 1.50±0.25 1.2±0.15
Notice :
  • The cumulative tolerance of 10 sprocket hole pitch is ±0.2mm.
  • Carrier camber shall be not more than 1mm per 100mm through a length of 250mm.
  • A & B measured 0.3mm from the bottom of the packet.
  • t measured at a point on the inside bottom of the packet to the top surface of the carrier.
  • Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole.

Soldering Condition (Reflow Soldering only) (LRP)

Reflow soldering
(LRP) Reflow Soldering
  • Time of IR reflow soldering at maximum temperature point 260°C:10s.
  • Time of soldering iron at maximum temperature point 410°C:5s

Environmental Characteristics (LRP)

Item Requirement Test Method
Thermal Shock
IEC-60115-1 4.19
JIS-C-5201-1 4.19
-55°C ~ 155°C, 5 cycles
Short Time Overload
IEC60115-1 4.13
JIS-C-5201-1 4.13
5*rated power for 5 seconds
Low Temperature Storage
IEC-60115-1 4.23.4
JIS-C-5201-1 4.23.4
at-55°C for 1000 hrs
Biased Humidity
MIL-STD-202 Method 103
1000 hrs 85°C/85% RH 10% of operating power
Bending Stength
IEC-60115-1 4.33
JIS-C-5201-1 4.33
Bending width 2mm once for 5 seconds
IEC60115-1 4.25
JIS-C-5201-1 4.25.1
70±2°C, RCWV for 1000 hrs with 1.5 hrs “ON” and 0.5 hrs “OFF”
Dry Heat
IEC60115-1 4.23.2
JIS-C-5201-1 4.23.2
at +170°C for 1000 hrs
Resistance to Soldering Heat
IEC-60115-1 4.18
JIS-C-5201-1 4.18
260±5°C, for 10 seconds
Insulation Resistance
IEC60115-1 4.6
JIS-C-5201-1 4.13
100V DC for 1 minute
95% min coverage
IEC-60115-1 4.17
JIS-C-5201-1 4.17
245±5°C for 3 seconds
Temperature Coefficient of Resistance (T.C.R.)
As Spec.
IEC60115-1 4.8
JIS-C-5201-1 4.8
-55°C ~+125°C. (25°C is the reference temperature)
  • Rated continuous Working Voltage (RCWV) = Power Rating × Resistance Value (Ω)or Max. Operating voltage whichever is lower.
  • Storage Temperature: 25±3°C; Humidity < 80%RH;

Order Codes (LRP)

LRP 12 F TR D S R050  
Product Type
12 EIA2512
Tolerance (%)
D ±0.5%
F ±1%
J ±5%
TR Taping Reel
D ±50PPM/°C
W ±75PPM/°C
Power Rating
T 1W
S 2W
R 3W
Resistance (Ω)
R015 0.015Ω
R050 0.05Ω
  No Marking